1. Home

REMOVE THE COPPER LAYER OF PCB BOARDS BY USING LASER ABLATION

Vitālijs Dunkins, Andris Martinovs

Abstract


The publication describes results of copper laser ablation which shows copper layer dependence of a laser radiation, such as supply, pulse frequency and processing speed reacts.

Keywords


laser ablation; PCB, copper; color

Full Text:

PDF

References


https://habrahabr.ru/company/madrobots/blog/214153/ (sk. 28.03.17)

Dr.-Ing. Bruno E. Buluschek, Manufacture of Laser Welded Composite Tubes. http://www.tubenet.org.uk/technical/swiss_m.html

D. Autrique, Z. Chen, V. Alexiades, A. Bogaerts, B. Rethfeld. A Multiphase Model for pulsed ns-Laser Ablation of Copper in an ambient Gas.

Andrea Cazzaniga, Rebecca Bolt Ettlinger, Stela Canulescu, Jørgen Schou, Nini Pryds. Nanosecond laser ablation and deposition of silver, copper, zinc and tin

K. K. Anoop, R. Fittipaldi, A. Rubano, X. Wang, D. Paparo, A. Vecchione, L. Marrucci, R. Bruzzese, and S. Amoruso. Direct femtosecond laser ablation of copper with an optical vortex beam.

Chung-Wei Cheng and Jinn-Kuen Chen. Drilling of Copper Using a Dual-Pulse Femtosecond Laser.

Михаил Петров, Лазерная обработка материалов в электронике, Компоненты и технологии №8, 2002;

В.Никируй, Лазерные технологии в производствепечатных плат и не только, печатный монтаж 2-3/2009;

Лазерная обработка материалов в электронике, Рынок микроэлектроники, http://www.compitech.ru/html.cgi/arhiv/02_08/stat_164.htm;

PowerLine F Assembly and Operating Instructions Version 1.0




DOI: https://doi.org/10.17770/het2017.21.3586

Refbacks

  • There are currently no refbacks.
Rēzeknes Tehnoloģiju akadēmija, 2016 © Atbrīvošanas aleja 115, Rēzekne, Latvija. Tālrunis: 28325368;
Jautājumus un ierosinājumus sūtiet uz helpdesk@rta.lv