REMOVE THE COPPER LAYER OF PCB BOARDS BY USING LASER ABLATION

Authors

  • Vitālijs Dunkins Rēzeknes Tehnoloģiju akadēmija (LV)
  • Andris Martinovs Rēzeknes Tehnoloģiju akadēmija (LV)

DOI:

https://doi.org/10.17770/het2017.21.3586

Keywords:

laser ablation, PCB, copper, color

Abstract

The publication describes results of copper laser ablation which shows copper layer dependence of a laser radiation, such as supply, pulse frequency and processing speed reacts.

Downloads

Download data is not yet available.

References

https://habrahabr.ru/company/madrobots/blog/214153/ (sk. 28.03.17)

Dr.-Ing. Bruno E. Buluschek, Manufacture of Laser Welded Composite Tubes. http://www.tubenet.org.uk/technical/swiss_m.html

D. Autrique, Z. Chen, V. Alexiades, A. Bogaerts, B. Rethfeld. A Multiphase Model for pulsed ns-Laser Ablation of Copper in an ambient Gas.

Andrea Cazzaniga, Rebecca Bolt Ettlinger, Stela Canulescu, Jørgen Schou, Nini Pryds. Nanosecond laser ablation and deposition of silver, copper, zinc and tin

K. K. Anoop, R. Fittipaldi, A. Rubano, X. Wang, D. Paparo, A. Vecchione, L. Marrucci, R. Bruzzese, and S. Amoruso. Direct femtosecond laser ablation of copper with an optical vortex beam.

Chung-Wei Cheng and Jinn-Kuen Chen. Drilling of Copper Using a Dual-Pulse Femtosecond Laser.

Михаил Петров, Лазерная обработка материалов в электронике, Компоненты и технологии №8, 2002;

В.Никируй, Лазерные технологии в производствепечатных плат и не только, печатный монтаж 2-3/2009;

Лазерная обработка материалов в электронике, Рынок микроэлектроники, http://www.compitech.ru/html.cgi/arhiv/02_08/stat_164.htm;

PowerLine F Assembly and Operating Instructions Version 1.0

Downloads

Published

2017-04-19

Issue

Section

Information technology, mechatronics, electronics

How to Cite

[1]
V. Dunkins and A. Martinovs, “REMOVE THE COPPER LAYER OF PCB BOARDS BY USING LASER ABLATION”, HET, no. 21, pp. 77–82, Apr. 2017, doi: 10.17770/het2017.21.3586.